News - 2008.05.09

Posted by Ken Cheung in News on Friday, May 9, 2008

OMG Unveils Details of Distributed Real-time Embedded Systems Workshop
The Object Management Group (OMG), announced the program for the Ninth Annual Distributed Object Computing for Real-time and Embedded Systems Workshop, which will be held July 14-16 in Arlington, VA. Stringent performance requirements are a feature of a broad range of computer applications, from enterprise-scale systems handling […]

conga-CMEN COM Express Module with Intel Menlow

Posted by Ken Cheung in Boards, Busses on Thursday, May 8, 2008

congatec AG recently introduced the conga-CMEN COM Express module, which is based on the Intel Menlow low-power platform for mobile computing. Fabricated using the latest 45nm process and Hi-K dielectric technology, the Intel Menlow platform comprises the Silverthorne processor, coupled with the Poulsbo chipset and integrated 3D graphics. This extreme power saving solution consumes just […]

News - 2008.05.08 Late Edition

Posted by Ken Cheung in News on Thursday, May 8, 2008

Korenix Unveils JetBox 9310 Embedded Computer for Harsh Environments
JetBox 9310 embedded computer is now available in a wide temperature model designed for use in harsh industrial environments. JetBox 9310 is a RISC-based embedded computer, system memory 64MB SDRAM default (128MB optional) and carries all major interfaces such as five Ethernet ports, two USB2.0 ports, two […]

News - 2008.05.08

Posted by Ken Cheung in News on Thursday, May 8, 2008

STMicroelectronics Introduces STMPE811 Touch Screen Controller IC
The new STMPE811 from STMicroelectronics (NYSE: STM), a world leader in analog semiconductors, is a four-wire resistive touch screen controller featuring autonomous functionality to minimize demands on the host processor. For embedded designers, this frees valuable CPU cycles to ease pressures on performance, power consumption and response times.
Valicore, jNet […]

BSQUARE DevKit OMAP35x and DevKit OMAP2530

Posted by Ken Cheung in BSP on Wednesday, May 7, 2008

BSQUARE Corp. (Nasdaq: BSQR) recently announced two new OMAP(tm) DevKit hardware development platforms to support TI's OMAP35x(TM) and OMAP25x(TM) platform. The DevKit OMAP35x and DevKit OMAP2530 each include a production-ready Windows® Embedded CE 6.0 board support package (BSP), and is the only development platform available supporting OMAP(TM) processors running Windows CE. The development platform and […]

News - 2008.05.07 Late Edition

Posted by Ken Cheung in News on Wednesday, May 7, 2008

Elma, DFT Microsystems Team on SerDes Test Modules for Embedded Systems
Elma Electronic Inc., a global manufacturer of electronic packaging products, and DFT Microsystems, a leader in high density test solutions for high-speed semiconductor device interfaces, have partnered to offer high-speed SerDes Test modules for the embedded systems market. The first Test module the companies are […]

RadiSys COM Express Starter Kits

Posted by Ken Cheung in Other on Wednesday, May 7, 2008

RadiSys Corporation (NASDAQ:RSYS) recently introduced a family of COM Express design starter kits that streamline COM Express product development. Manufacturers of equipment for imaging, industrial automation, gaming, and test & measurement applications can now obtain all the hardware they need for COM Express prototyping by using a single order code. RadiSys COM Express starter kits […]

News - 2008.05.07

Posted by Ken Cheung in News on Wednesday, May 7, 2008

Concurrent Technologies Debuts SY AMC/205 MicroTCA Development System
Concurrent Technologies announces a MicroTCA[tm] System designed to aid the bench development of MicroTCA[tm] applications. The SY AMC/205 is a 5-slot MicroTCA free-standing cube which supports up to 5 AdvancedMC[tm] (AMC) modules. To focus the development process the SY AMC/205 comes pre-loaded with a dual-core processor AMC, a […]

CoWare ESL 2.0 Android Mobile Platform Support

Posted by Ken Cheung in Embedded Systems, Wireless on Tuesday, May 6, 2008

CoWare®, Inc. recently announced a solution for the rapid design and development of chipsets, handsets, and software applications built to support the Android(tm) Mobile Platform. CoWare ESL 2.0 solutions are built to enable the deployment of virtual hardware platforms across the supply chain, leading to more productive collaboration while designing the right products. The support […]

News - 2008.05.06 Late Edition

Posted by Ken Cheung in News on Tuesday, May 6, 2008

Sentilla Launches Pervasive Computing Platform at JavaOne Conference
Sentilla unveiled its pervasive computing platform, a breakthrough in Java technology that paves the way for Java developers to solve problems as never before. Sentilla's innovation allows tiny, dime-sized computers to run the same Java platform that powers computers tens to hundreds of times larger. Pervasive computers are […]

Kontron CP6014 CompactPCI Processor Board

Posted by Ken Cheung in Boards, Busses on Tuesday, May 6, 2008

The Kontron CP6014 is a 6U CompactPCI processor board with two 45 nanometer quad-core Intel Xeon L5408 processors, Intel 5100 Memory Controller Hub (MCH) chipset, and Intel I/O Controller Hub 9R. The Kontron CP6014 CompactPCI processor board targets storage, wireless infrastructure, security, voice, and the medical market segments. Taken in conjunction with the advantages of […]

News - 2008.05.06

Posted by Ken Cheung in News on Tuesday, May 6, 2008

AXIOMTEK Launches eBOX647-FL Fanless Embedded Computer with VIA C7 CPU
AXIOMTEK is pleased to release the eBOX647-FL, a fanless and cost-effective embedded computer, which supports an onboard low power VIA C7 1.5 GHz processor with the VIA CX700 single-chip core logic controller. The eBOX647-FL features compact-size, multiple I/O, easy access mechanism, and a unique anti-vibration and […]

Intel Xeon 5200 and Xeon 5400 for Embedded Systems

Posted by Ken Cheung in Microcontrollers on Monday, May 5, 2008

Intel Corporation recently announced new processors for embedded systems market. The new processors feature 7-year life cycle support, a new chipset, and a carrier-grade server. The processors, based on Intel's revolutionary high-k, metal gate transistor formula and manufactured on the company's 45-nanometer (nm) process, include the Quad-Core Intel® Xeon® processor 5400 Series and Dual-Core Intel® […]

News - 2008.05.05 Late Edition

Posted by Ken Cheung in News on Monday, May 5, 2008

Apache Design Offers Chip Package Co-Design Methodology Webinar
Apache Design Solutions, the technology leader in power, noise, and reliability (PNR) signoff for chip, package, and system designs, announced that the company will present an online technical webinar entitled "Chip-Package Co-Design: Applying Chip Power Model in System Power Integrity Analysis." Apache will detail the methodology used for […]

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